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Articles published by Cadence Design Systems, Inc.

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Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Completes Acquisition of PHY IP Assets from Rambus
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s John Wall to Present at Deutsche Bank Conference
From Cadence Design Systems, Inc.
Via Business Wire
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The Clinton Health Access Initiative to Partner with the Cadence Giving Foundation on Sustainable Climate Innovation
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Reports Second Quarter 2023 Financial Results
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence to Acquire Rambus PHY IP Assets
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Announces Second Quarter 2023 Financial Results Webcast
From Cadence Design Systems, Inc.
Via Business Wire
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Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry’s SF2 and SF3 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes
From Cadence Design Systems, Inc.
Via Business Wire
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DB GlobalChip Deploys Cadence’s Spectre FX and AMS Designer, Accelerating IP Verification by 2X
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Announces $200 Million Accelerated Share Repurchase Agreement
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s John Wall to Present at BofA Securities Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s Anirudh Devgan to Present at Bernstein Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence’s John Wall to Present at Needham Conference
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Appoints Mary Louise Krakauer as Chair of the Board
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Delivers New Design Flows Based on the Integrity 3D-IC Platform in Support of TSMC 3Dblox™ Standard
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Digital and Custom/Analog Design Flows Certified for TSMC’s Latest N3E and N2 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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Cadence Custom Design Migration Flow Accelerates Adoption of TSMC N3E and N2 Process Technologies
From Cadence Design Systems, Inc.
Via Business Wire
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